Chips, GPUs, processors, and the physical infrastructure powering the digital world.
105 articles
The $100 jump leaves Nvidia's flagship Android TV box at its highest price yet, with the cheaper tube model now out of production as memory costs ripple through consumer electronics.
The iPhone maker will introduce a 6-inch smart display code-named J490, a refreshed HomePod mini, and a new Apple TV box, according to Bloomberg.
The joint venture between Vanguard International Semiconductor and NXP has started risk production at its Tampines plant, targeting 44,000 wafers a month and 1,600 jobs by 2029.
The South Korean memory maker took home the 3DFabric-HBM Integration honor at TSMC's Santa Clara conference and showed HBM4 and SOCAMM2 running inside Nvidia's Vera Rubin.
The multi year agreement pairs Cerebras wafer scale accelerators with Gimlet Labs disaggregated inference software, aiming at up to 3,000 tokens per second for agentic and real time workloads.
Taiwanese media reports say TSMC has started pilot runs for its 1.4nm A14 node at two Taiwan fabs, with risk production expected in 2027 and volume output in 2028.
Schenker and its XMG brand will charge EUR 100 to EUR 300 more for most laptops after DDR5 SO-DIMM modules reached roughly six times their mid 2025 prices, and the firm expects the memory shortage to run into 2027.
Micron has marked its 2GB GDDR7 memory chips as end of life, leaving only 3GB modules and raising questions about supply for Nvidia's GeForce RTX 50 series GPUs.
Micron has designated both of its 2GB GDDR7 parts as End of Life, trimming Nvidia's RTX 50 memory supply base to Samsung and SK hynix while its 3GB modules remain in production.
Qualcomm's two new flagship platforms use a 2nm TSMC process and a 5GHz Oryon CPU to run on-device AI agents, with the Extreme tier adding 8K60 video and 18MB of GPU memory.
Eddie Wu used the Apsara conference to launch the T-Head Zhenwu V900, tout three times the performance of the M890, promise a 20GW cloud buildout and confirm Qwen models up to 10 trillion parameters.
Taiwan has begun building the 88.73 hectare Baipu Industrial Park in Kaohsiung, where TSMC will open advanced packaging validation and training facilities in late 2029.
ChangXin Memory Technologies says its G5 DRAM platform reaches an 11.95 nanometre active-area half-pitch using quadruple patterning, claiming a process leap achieved without EUV lithography.
Japan and the United States are negotiating a ¥2 trillion to ¥3 trillion logic chip factory on American soil that GlobalFoundries would operate under a $550 billion investment pledge, Nikkei reported.
Anderon LLC, an IBM subsidiary, has locked in a $1 billion federal award for a 300 millimeter quantum wafer foundry in Albany, New York, with first wafers already in production.
The US equipment maker will spend 5 billion dollars through 2035 on a 140 acre research park near Bengaluru, a tenfold supply chain expansion and a larger R&D workforce in India.
A first ever American memory fabrication could emerge from the discussions, either through a lease inside Intel's delayed Ohio site or a joint venture that adds cloud providers as partners.
Meta Platforms is testing its third-generation MTIA 450 Arke AI chip, built with Broadcom and TSMC, for data center deployment in the first half of 2027.
The Taiwanese chip designer says its new flagship mobile processor, built on TSMC's 2-nanometre node, cuts multi-core power by 61% while adding on-device AI models up to 30 billion parameters.
JPMorgan analysts say ASML could produce more than 110 extreme ultraviolet lithography systems in 2028, up from about 65 expected in 2026, as AI chip demand keeps the 2027 order book nearly sold out.
The University of Pretoria's CEFIM has installed an Anritsu 220 GHz VectorStar VNA, doubling its calibrated measurement ceiling from 110 GHz to 220 GHz and creating Africa's only comprehensive sub-terahertz facility.